Gigabyte Base Plate 1700 Z690 Aorus Elite AX 1.1

Gigabyte 1700 Z690 Aorus Elite AX 1.1 Base Plate

It rules supreme with the base plates for Z690 AORUS games. The new king of the gaming platform contin the legendary AORUS lineage with the delivery of energy &iachores robusta and a dise ñ or t &eametos rmico domineering, glorified with the technology í a complete memory overclocking to crown your PC with the best performance of Alder Lake in all its gaming splendor.

UNMATCHED PERFORMANCE

With the technolog íres a movi &eacerudos ndose tân r &aacupido pido, GIGABYTE a ún se maintains al d íres a con las &uantimas ltimas tendencias y ará a nuestros múnteriones emidadas y la úres ltima tecnolog &iacítá a. The base plates of the Z690 series of GIGABYTE come with a solution of improved energy, the latest &uendares and an exceptional connectivity to optimize the performance of the games.

Dise ñ or VRM double h &iasties brid

To ensure the maximum performance of Turbo Boost and overclocking of Intel's new generation CPU, the GIGABYTE Z690 series equips the best ñ or VRM jam &arecars created with high quality components.

Dise ñ or PCIe 5.0

GIGABYTE Z690 base plates are ready to run with the top-of-the-line PCIe 5.0 devices that are expected to experience twice as much bandwidth as current PCIe 4.0 devices. To achieve high speed and maintain good integrity of the ñ, the GIGABYTE R & D department uses the low-impedance PCB to provide the maximum performance.

Optimizing n &ute; cleos h &iUtidos bridos

With the new Intel Hybrid technology, GIGABYTE exclusively creates two new "CPU Updates" in the BIOS profiles to meet different user scenarios by adjusting the P-Core and E-Core voltage and activation policy.

EXTREME MEMORY

GIGABYTE Z690 base plates have the latest DDR5 architecture and XMP 3.0 capability. The new DDR5 memory technology provides 50% of bandwidth to the platform and increases the performance of the system by implementing the unblocked native DDR5 voltage, the Xtreme memory routing and the reliable SMD slot. In addition to hardware upgrades, the user interface f &arecucil to use provides full functionality to increase overclocking with the unique DDR5 tuning capability.

DDR5 XMP compatibility up to 6000 MHz and m &aalds

AORUS offers a proven and proven platform that ensures proper compatibility with profiles up to 6000 MHz and m &aws. All users must do to achieve this performance increase is to ensure that their memory module is compatible with XMP and that the XMP function is enabled and enabled on its AORUS motherboard.

Armored memory routing

All memory routing is below the internal layer of the PCB protected by a large layer of land to protect it from external interference.

Ultra Durable SMD DDR5 Memory Armor

Dise ñ or GIGABYTE exclusive stainless steel shield.

DDR5 &aaitic self-amplifier

Auto-increases the native DDR5 frequency to 5000MHz while the system is under heavy load with a single click.

DDR5 Memory &oastion

GIGABYTE BIOS offers predefined and recoverable profiles for users to obtain better performance than they can easily. The profiles are based on a database that is created by verifying each memory IC and the PMIC providers to optimize the modules and unlock their full potential. This is a time-saving &ioustica character when manually configuring the overclocking DDR5 memory kits.

XMP 3.0 user profile

Define and create your own SPD profile in either native memory modules and XMP 3.0 or apply the pre-adjusted profiles to the XMP 3.0 user profile. Two user-defined profiles, loaded locally or from/to an external storage device, can be saved.

RMICA T ARMOR

The performance without the {\cs6\f1\cf6\lang1024} {\cs6\f1\cf6\lang1024} {\cs6\f1\cf6\lang1024} {\cs6\f1\cf6\lang1024} {\cs6\f1\cf6\lang1024} {\cs6\f1\cf6\lang1024} {\cs6\f1\cf6\lang1024} series of the Z690 series

Large Surface 2X

The surface area increased up to 2 times greater in comparison with traditional heat sinks. Improves the heat dissipation of the MOSFET.

Construct a piece's real &oasion

TMOS is a TRUE one-piece heat sink. Its dise ñ or a piece and its large surface area improve the performance of refrigeration in front of the dise ñ or of the competition ltiples.

Dise ñ or multicut

TMOS has multiple channels and entries in the heat sink. This dise ñ or allows air flow to pass, leading to a large improvement in heat transfer performance.

AORUS M. 2 II Rmico T &erenic Protector

The M. 2 Thermal Guard II uses a ñ or dual-sided heat sink, and prevents slow down and bottlenecks on high-speed M. 2 SSDs by dissipating heat before it becomes a problem.

3% m cool &aecons when implementing the ñ or 2X copper PCB

By adopting copper 2X in the internal layer of the PCB, it reduces the temperature of the components by at least 3% by converting the PCB to a copper heat sink of the tama ñ or a thin-to-thin PCB to dissipate the heat of the components effectively, due to its high conductivity and less impedance.

Smart Fan 6

Numerous headers of fans and temperature sensors are placed on the motherboard to monitor in real time and configure the fan mode to accommodate different workloads to Smart Fan 6. The creators can set the activation point to activate the fan and its corresponding speed. The fan is completely stopped when light tasks are performed to avoid noise.

Fan Stop

With Fan Stop, program any fan so that it stops completely when temperatures fall below a specific threshold. What fan is stopped, and the readings of the sensor are stopped, and the temperature, everything can be customized to your liking.

Specifications:

• Details T &eUcics
  • Format: ATX
  • Chipset: Intel Z690
  • Multi-GPU: 2-Way AMD CrossFire, AMD Quad CrossFire
  • Amount of PCI Express slots: 3
  • Processor family: Intel
  • Supported hard disk drive interfaces: M. 2 PCIe, M. 2. SATA, Serial ATA III
  • N Number of supported processors: 1
  • N DIMM slots: 4

Processor

• Processor Socket: Socket 1700
• Processor Family: Intel Core i3-12 ª Gen, Intel Core i5-12 ª Gen, Intel Core i7-12 ª Gen, Intel Core i9-12 ª Gen
• Memory
  • Memory slots
  DIMM
  • Internal memory m &axime: 32 GB
  • Non-ECC: Yes
  • Memory-less memory: Yes
  • Memory channel support: Dual
  • Supported memory types: DDR5-SDRAM
  • Supported memory clock speeds: 4000 MHz, 4800 MHz, 5200 (OC), 5400 (OC), 5600 (OC), 5800 (OC), 6000 (OC)
• V &iuteres deo
  • Graphics chipset: Intel
  • HDCP: Yes
  • M &axime resoluci &oatron n: 4096 x 2304 Pixels
• Audio
  • Audio output channels: 7.1
  • Audio system: Realtek ALC1220-VB

Expansion slots

• Configurations PCI Express: 3 x16
• N (total) PCI Express slots: 3
• PCI Express slots x16: 3
• Versi PCI Express entries: 3.0, 5.0

Internal I/O

• Power Connector to EPS (8-pin): 1
• CPU Fan Connector: Yes
• ATX Power Connector (24 pins): Yes
• Front Panel Audio Connector: Yes
• Fan Connector: Yes
• TPM Connector: Yes
• USB 2.0 connectors: 1
• USB connectors C: 1
• N &o number of connectors to chassis fan 3: 6
• Connectors M. 2: 4
• Strips RGB/LED Connectors: 4
• Cooling Connectorsn L &iacuity: 1
• Connector for Thunderbolt: 2

Rear Panel I/O Ports (Input/Output)

• Speaker, headphone, jack of output: 1
• Amount of DisplayPorts: 1
• Number of USB ports 2.0: 4
• Number of USB ports 3.2: 5
• Ethernet (RJ-45): 1
• PS/2 Port &ofinch: 1

Regulators

• RAID Levels: 0, 1, 10, 5

• Bluetooth: Yes
• Network &iacitists Character: 10/100/1000/2500 Mb/s
• Network &o &o: Yes
• Ethernet Controller: Realtek 2.5 GbE
• Ethernet: Yes
• Wi-Fi est &aed. ndars:   IEEE 802.11a, IEEE 802.11b, IEEE 802.11g, IEEE 802.11g, IEEE 802.11g
IEEE 802.11n
• Wi-Fi:
• BIOS
  • BIOS, tama ñ or memory: 256 MB
  • Types of BIOS: AMI UEFI
  • Versi &oatuos ACPI: 5.0
• Weight and dimensions
  • Width: 30.5 cm
  • Depth: 24.4 cm