Gigabyte Base Plate 1200 Z490 Aorus Xtreme 1.1

Gigabyte Base Plate 1200 Z490 Aorus Xtreme 1.1

With a ñ or cutting edge, excellent functionality, an impressive ñ or t &eetuermic, network connectivity of top generation &oatecon, a Hi-Fi level audio system, and the AORUS test, the flagship Z490 AORUS XTREME base plate dominates the competition.

To unlock the full potential of the new 10 n ú Intel CPU, the motherboard requires the best ñ or CPU power. With components of the best quality and capacity of GIGABYTE ' S ñ or R & D, Z490 AORUS XTREME is a true beast between the base plates.

Dise ñ or 16 + 1 power phases

The base plate Z490 AORUS XTREME uses a ñ or a pure digital CPU power that includes a digital PWM controller with intelligent power stages and is capable of providing 90 A power of each phase for a total of 1440 A. This 100% digital controller, the new matrix of 8 + 8 pin-level power supply capacitors and the additional 8-pin CPU power connectors provide a value for the power supply to the energy-sensitive base plate components.&iute; a.

Dise ñ or power-to-true

In order to unleash the full performance of the new high-n &uetuum-only CPU, GIGABYTE uses real power phases, a fully balanced Dñ or VRM with duplicators and a matrix of tantalum-grouse pol capacitors. When using duplicators, the ñ or power íres ensures that the high power consumption of the CPU is completely balanced in all MOSFET to achieve better efficiency and low temperatures. On the contrary, the MOSFET of the competitors The dise ñ traditional power in parallel is not so well balanced, leading to lower efficiency and high temperatures. For sudden changes between the idle and high CPU load states, GIGABYTE uses a matrix of the tantalum-grouse pol &iuders directly below the CPU's z óres as a b &uacuerdo to improve the transient response and stability under high CPU frequencies.

Enhanced transient response

By using a new Dñ or VRM and a matrix of tantalum-grouse pol-or-mer capacitors, the transient response and stability of the Z490 AORUS motherboard are greatly improved in overclocking and heavy loading conditions.

2x copper PCB

The ñ or exclusive 2X copper PCB from GIGABYTE provides enough energy trace paths to between the components to handle higher than normal power loads and remove the heat from the CPU &iUte; power delivery í s. This is essential to ensure that the motherboard is able to handle the power load increase í to what is required when overclocking is performed.

REACTIVE RMICA T ARMOR

Z490 AORUS XTREME uses an innovative and unprecedented solution to ensure the best CPU, Chipset, SSD and low temperature stability in applications and full load games.

• Fins Matrix II

Fins-Array II uses a new technology of blind-stacked fins that is usually only used in industrial equipment that needs compact heat exchangers. It has a special secondary fin structure that improves heat transfer performance.



• -driven flow

The flow of heat that passes through the flaps come in from the front edge of the grid and then be guided by other grids or fins. This flow led by the grids can greatly improve the performance of heat transfer.

• -angle connectors

Z490 AORUS XTREME uses a ñ or revolutionary connector on the right side, 90% of the pins and pins of pins on the base plate are attached to the straight line and are relocated to one side of the PCB. The ñ or never saw help for a simple cable management m &aecons and better air flow in the chassis when installing a large number of devices.

• Nanocarbon-coated fins array heat-Disipper

As the CPUs become powerful, the VRM dules are heated with ultra-high performance. Being the first to adopt among the industry that uses NanoCarbon as coating material to improve radiation and speed up the dissipation of heat. The heat sink is coated with nanocarbon by means of an electrost. The coating material covers the entire heat sink with fins with a thickness of 200 μ m. In this way, the heat dissipates m &arecuentas quickly. The tests show 10% m &aaitis or with the NanoCarbon coating.

• AORUS M. 2 II Rmico T Protector

Considering durability, GIGABYTE offers a new solution for large capacity SSD M. 2 devices with double-sided flash. The M. 2 Thermal Guard II uses a ñ or double-sided heat sink and avoids bottlenecks and bottlenecks on high-speed M. 2 SSD when dissipating heat before it becomes a problem.

• Smart Fan 5

With Smart Fan 5, users can ensure that their PC gaming can maintain their performance while remaining cool. Smart Fan 5 allows users to exchange their fan headers to reflect different thermal sensors at different locations on the motherboard. Not only that, with Smart Fan 5 have been introduced m &iactionals fan heads that support PWM and Voltage mode fans to make the motherboard friendly with cooling

.
• Fan Stop

Achieves fan silence with Fan Stop, maps any fan so that it stops completely when temperatures fall below a specific threshold. What fan is stopped, and the readings of the sensor are stopped, and the temperature, everything can be customized to your liking.

• Brides fan connectors

&iex; Assume full control over your cooling configuration &oatutin l í! Smart Fan 5 receives updated information on the flow rate and temperature of the water to be delivered from the pins of the fan pins h íbro or external thermistor sensors, which gives you an absolute mastery over your PC.

• New Smart Fan 5 software

Choose between different modes, silent at speed m &axime, to match your system usage preferences. For each fan or pump, you can use the intuitive fan curve to define the trigger thresholds and the corresponding fan speeds.

• Detection

With the new noise detection function, you can monitor the noise level of all the devices, including fans, CPU coolers, gr cards, etc. in real time, and you can determine what the speed of your fan should be.



Specifications:

• Details T &eUcics
  • Format: Extended ATX
  • Chipset: Intel Z490
  • Multi-GPU: 2-Way AMD CrossFire, 2-Way NVIDIA SLI, AMD Quad CrossFire, NVIDIA Quad SLI
  • Number of PCI Express slots: 3
  • Processor family: Intel
  • Supported hard disk drive interfaces: M. 2 PCIe, M. 2. SATA, Serial ATA III
  • N Number of supported processors: 1
  • N DIMM slots: 4
Processor
• Processor Socket: Socket 1200
• Processor Family: Intel Celeron, Intel Core i3-10 ª Gen, Intel Core i5-10 ª Gen, Intel Core i9-10 ª Gen, Intel Pentium
• Memory
  • Memory slots
  DIMM
  • Internal memory m &axime: 128 GB
  • Supported memory module capacities: 32 GB
  • Non-ECC: S &iute;
  • Memory without buffer: S &iute;
  • Memory channel support: Dual
  • compatible memory types: DDR4-SDRAM
  • Supported memory clock speeds: 2133 MHz, 2400 MHz, 2666 MHz, 2800 MHz, 2933 MHz, 3300 (OC), 3400 (OC), 3800 (OC), 4133 (OC), 4400 (OC), 4700 (OC), 4800 (OC), 4933 (OC), 4800 (OC), 4933 (OC), 5000 (OC)
  • V &iUteres
  • HDCP: S í&oatecn: 5120 x 2880 Pixels
Audio
• Audio output channels: 2, 4, 5.1, 7.1
• Audio system: Realtek ALC1220-VB
slots &oatecn
• PCI Express Configurations: 3 x16
• N &uterer (total) PCI Express slots: 3
I/O
• Connector to EPS (8-pin): 2
• ATX Power Connector
• 24 pins): S &iute;
• Front panel audio connector: S &iute;
• Fan connector: S &iutejo
• USB 2.0 connectors: 1
• USB connectors 3.2: 1
• USB connectors C: 1
• N &uterer of connectors to chassis fan: 4
• N &uterer of SATA connectors 3: 6
• RGB/LED strips
Input/Output
• • Speaker, headphone, jack of output: 5
  • Amount of USB ports 2.0: 2
  • Amount of USB ports 3.2: 6
  • Number of ports Thunderbolt: 2
  • Ethernet (RJ-45): 2
  • S/PDIF Output Port: 1
• Storage Regulators
  • RAID Levels: 0, 1, 10, 5
• • Bluetooth: S &iute;
  • Character &iacitists Network: 100/1000/2500/5000/10000 Mb/s
  • Internet Controller: S &iute; s
  • Ethernet: S &iute;
  • Wi-Fi est &aed.: IEEE 802.11a, IEEE 802.11b, IEEE 802.11g, IEEE 802.11n
  • Versi Bluetooth: 5.1
  • Wi-Fi: S í
• BIOS
  • BIOS switch BIOS ón: S &iute;
  • BIOS, tama ñ or memory: 2x 256 MB
  • BIOS types: AMI UEFI
  • Versi &oatuos ACPI: 5.0
  • Weight and dimensions
    • Width: 30.5 cm
    • Depth: 27.1 cm