ASUS ROG 1200 Maximus XIII Apex Base Plate

ASUS ROG 1200 Maximus XIII Apex Base Plate
ASUS ROG 1200 Maximus XIII Apex Base Plate
ASUS ROG 1200 Maximus XIII Apex Base Plate
ASUS ROG 1200 Maximus XIII Apex Base Plate, Img
ASUS ROG 1200 Maximus XIII Apex Base Plate
ASUS ROG 1200 Maximus XIII Apex Base Plate, Img 1
ASUS ROG 1200 Maximus XIII Apex Base Plate
ASUS ROG 1200 Maximus XIII Apex Base Plate, Img 2
ASUS ROG 1200 Maximus XIII Apex Base Plate
ASUS ROG 1200 Maximus XIII Apex Base Plate, Img 3
ASUS ROG 1200 Maximus XIII Apex Base Plate
ASUS ROG 1200 Maximus XIII Apex Base Plate, Img 4
ASUS ROG 1200 Maximus XIII Apex Base Plate
ASUS ROG 1200 Maximus XIII Apex Base Plate, Img 5
ASUS ROG 1200 Maximus XIII Apex Base Plate
ASUS ROG 1200 Maximus XIII Apex Base Plate, Img 6
ASUS ROG 1200 Maximus XIII Apex Base Plate
ASUS ROG 1200 Maximus XIII Apex Base Plate, Img 7
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ASUS ROG 1200 Maximus XIII Apex Base Plate

PUSHED TO THE APEX

For generations, the optimized ñ s that reduce latency and increase bandwidth have allowed the base plates of the ROG Apex series to dominate numerous global cords. Maximus XIII Apex &uteres to that legacy by extending power delivery and adding overclocking enhancements for the Intel Core 11 ª processors. Those updates are merged with the latest connectivity options to drive the goal and bring the performance of the race track to the daily platforms.

AS WITH IA

Smart software solutions help ensure your system works at a maximum level. The latest ASUS AI-driven enhancements cover four performance pillars, including overclocking, cooling, networking, and integrated audio, making advanced settings and optimization accessible for both new recruits and PC DIY experts.

    • Overclocking with AI

    The adjustment is now m &aemacas r &aasicas pido e inteligente que never. ASUS AI Overclocking profiles the CPU and cooling to predict the configuration and take each system to its clients.

      • cooling

      Balance the thermal and the ac &uestics of any construction with a single click. A patented ASUS algorithm reduces the system's unnecessary noise by monitoring CPU temperatures and mically adjusting the fans to the latest.

        • networks

        The GameFirst VI utility optimizes network performance by assigning real-time bandwidth to the application scenarios and corresponding learning algorithms.

          • Cancelation of bidirectional noise with IA

          This utility takes advantage of a huge deep learning database to reduce the 500 million types of background noise from incoming or outgoing audio, helping to ensure a communication &iecatecd to games or calls.

          OVERCLOCKING

          ROG Maximus XIII Apex makes overclocking accessible for both beginners and experienced enthusiasts. Your smart power &o &o &o solution meets the demands of the latest Intel processors, while comprehensive controls give you the tools you need to increase performance.

            • Overclocker toolkit

            A Tookit from Overcloker with hardware-level controls help you &aaiqué to your overclocking experience.

              • condensing detector

              The specialized circuits allow Maximus XIII Apex to detect cu. The condensing occurs at the back of the plate. Divided into three distinct sections: CPU, DRAM, and PCIe, the function provides a useful warning when an area can be at risk of short circuit.

              ENERG &O N &OS

                • í to team architecture

                Modern CPU architectures increase the bet by the ñ or power ía on the motherboard by moving from the power saving modes to deep to the full load almost instant. The latest ROG VRM architecture &uteres up to the height of the desaf í or when using power stages in equipment to quickly change the current, while maintaining an exemplary rmico t performance.

                  • A change in CPU requirements

                  Today's CPUs contain m &uteacas cleos as their predecessors, and the latest set of instructions allow them to process computationally dense workloads at an incrate rate. As an additional benefit, these processors also consume less energy at rest and can make the transition between load states much more quickly. These improvements required a reevaluation of the ñ or energy ñ priorities because the phase duplicators add a propagation delay that makes the transient response difficult.

                    • Power Stages

                    The latest integrated power components can handle high currents that are or, or, make it possible to implement a simple circuit-to-loop topolog that is not hindered by the processing delay of the phase duplicators. That is why the ROG Maximus XIII Apex uses combined power stages to deliver a higher stream of r &ahaufaga per phase, while maintaining the performance t &eacermic of the duplicate phase ñ s.

                      • Rmic Performance

                      Each VRM component has a specific purpose &iute; prop. The PWM controllers control the circuit and the power stages do the heavy work from a point of view the electrical and t &eacermic. That's why ROG Maximus XIII Apex uses 18 stages of power. The high-end power stages have a low RDSON to reduce the switching &oatment and drive &oatern, which helps to improve the overall performance margin.

                      Specifications:

                      • Details T &eUcics
                        • Format: ATX
                        • Chipset: Intel Z590
                        • Processor Family: Intel
                        • Supported Hard Disk Drive Interfaces: M. 2, Serial ATA III
                        • N Number of Processors Supported: 1
                        • N Processor Slot Number: 2
                    • Processor
                          : Socket 1200
                        • Processor Family: Intel Celeron, Intel Core i3-11 ª Gen, Intel Core i5-11 ª Gen, Intel Core i7-10 ª Gen, Intel Core i7-11 ª Gen, Intel Core i9-10 ª Gen, Intel Core i9-11 ª Gen, Intel Pentium
                      • Memory
                        • Memory slots: 2x DIMM
                        • Memory slot type: DIMM
                        • Internal memory m &axime: 64 GB
                        • Supported memory module capacities: DDR4-SDRAM
                        • Internal I/O
                          • Connector for Thunderbolt: 1
                          • Rear Panel I/O Ports (Input/Output)
                            • Speaker, headphone, output jack: 5
                            • Number of USB ports 3.2: 9
                            • Amount of USB ports Type-C: 1
                            • Ethernet (RJ-45): 1
                            • Port of rat &oatro n-keyboard PS/2: 2
                            • Output port S/PDIF: 1
                            • Bluetooth
                            • Character &iacitists network: 10/100/1000/2500 Mb/s
                            • Network connection: S &iute;
                            • Ethernet: S &iute; s
                            • Wi-Fi est &aed. ndars: IEEE 802.11a, IEEE 802.11b, IEEE 802.11g, IEEE 802.11n
                            • Versi Bluetooth: 5.2
                            • Wi-Fi: S í
                          • Weight and dimensions
                            • Width: 30.5 cm
                            • Depth: 24.4 cm

Related categories:Motherboards